The Qianli QS26 Bumblebee Stencil is a high-precision reballing stencil designed for Phone CPU 2 series chipsets. Manufactured with integrated steel mesh technology, it ensures uniform tin ball formation, rapid heat transfer, and excellent durability. Its anti-deformation build withstands repeated high-temperature usage, making it ideal for professional IC repair, reballing, and motherboard servicing. A reliable choice for technicians who demand both efficiency and accuracy in mobile CPU repair.
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