The RELIFE RL-429 BGA Flux Paste is a high-performance, rosin-based soldering flux engineered specifically for BGA (Ball Grid Array) component reballing, SMD servicing, and lead-free PCB electronics repair. Formulated with high-activity ingredients, this flux paste enhances solder flow, reduces oxidation, and promotes optimal heat transfer to create strong, durable, and reliable solder joints while preventing common defects like cold joints and bridging.

Packaged in a compact 20ml squeeze tube featuring a long-mouth nozzle design, RL-429 allows technicians to apply controlled, precise amounts of flux directly onto micro-soldering joints without mess or wastage. It features a firm paste consistency with excellent viscosity and leaves minimal, low-corrosion residue that can be easily cleaned using standard flux removers.

Key Features

1. Specialized Lead-Free Formulation: Tailored for lead-free BGA reballing, IC soldering, and SMD rework.
2. Strong & Reliable Bonds: Promotes excellent wetting and fluid solder flow to eliminate cold solder joints and bridging.
3. Precision Long-Mouth Dispenser: Squeeze hose packaging with a long nozzle tip enables accurate micro-dosing directly onto tight PCB areas.
4. Low Residue & Easy Cleaning: Leaves minimal, non-conductive residue after heating, simplifying post-soldering cleanup.
5. Thermal & Oxidation Protection: Enhances thermal conduction and reduces oxidation during high-temperature rework.
6. Sealed for Long Shelf Life: Strong sealing cap prevents drying, hardening, and leakage during workbench storage.

Specifications

1. Brand: RELIFE
2. Model: RL-429
3. Product Type: Rosin-Based BGA Soldering Flux Paste
4. Volume: 20 ml
5. Formulation: Lead-Free, Rosin Base, Low Residue
6. Packaging: Squeeze Tube / Hose with Precision Long Mouth
7. Application: BGA Reballing, Mobile Phone PCB Repair, SMD Soldering, Micro-Soldering Rework

Usage Steps

1. Apply Flux: Gently squeeze the tube to apply a small, controlled amount of flux paste to the target BGA pads or solder joints.
2. Heat Joint: Apply heat using a hot air rework station or precision soldering iron tip.
3. Allow Flow: Let the solder melt and flow smoothly to form clean, solid solder joints.
4. Clean Up: Remove any minor remaining residue with PCB cleaner or flux remover if necessary.

Package Includes

1. 1 × RELIFE RL-429 20ml BGA Flux Paste Tube

Important Notice & Terms

Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.