Welsolo VS01 Reballing Stencil for PCB & BGA Chip Repair

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₹99.00

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Overview
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The Welsolo VS01 Stencil is designed for precise solder paste application and reballing during PCB and BGA chip repairs. Made from durable metal, it ensures long-lasting performance and accuracy, making it ideal for mobile phone motherboard repair and other electronic soldering applications.

Key Features:
🔹 Easy to Use – Smooth design for quick solder paste application.
🔹 High-Quality Material – Made from durable metal alloy for repeated use.
🔹 Precision Apertures – Ensures accurate solder ball placement on pads.
🔹 Reballing Support – Suitable for BGA chip rework and component replacement.
🔹 Versatile – Ideal for mobile phone PCB, CPU, and IC repairs.

Specifications:
Model: Welsolo VS01
Material: Metal Alloy (Durable & Heat Resistant)
Application: PCB Repair, BGA Reballing, IC/CPU Chip Repair
Design: Precision aperture layout for accurate solder deposition

Supported Model:

BT WIFI RF Universal Steel Stencil

Packing Details:
1 × Welsolo VS01 Stencil

Why Choose This?
With its high precision and durable build, the Welsolo VS01 Stencil is a must-have tool for technicians handling motherboard repairs, reballing, and IC chip soldering work.

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