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Ycs | Mr.Yang
Relife
2UUL
Sunshine
Qianli
FORWARD
UNI-T
F64
Mechanic
The Welsolo VS01 Stencil is
designed for precise solder paste application and reballing during PCB and BGA
chip repairs. Made from durable metal, it ensures long-lasting performance and
accuracy, making it ideal for mobile phone motherboard repair and other
electronic soldering applications.
Key Features:
🔹
Easy to Use – Smooth design for quick solder paste application.
🔹
High-Quality Material – Made from durable metal alloy for repeated use.
🔹
Precision Apertures – Ensures accurate solder ball placement on pads.
🔹
Reballing Support – Suitable for BGA chip rework and component replacement.
🔹
Versatile – Ideal for mobile phone PCB, CPU, and IC repairs.
Specifications:
Model: Welsolo VS01
Material: Metal Alloy (Durable & Heat Resistant)
Application: PCB Repair, BGA Reballing, IC/CPU Chip Repair
Design: Precision aperture layout for accurate solder deposition
Supported Model:
BT WIFI RF Universal Steel Stencil
Packing Details:
1 × Welsolo VS01 Stencil
Why Choose This?
With its high precision and durable build, the Welsolo VS01 Stencil is a
must-have tool for technicians handling motherboard repairs, reballing, and IC
chip soldering work.
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