Welsolo VS02 Reballing Stencil for PCB & BGA Chip Repair

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₹99.00

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Overview
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The Welsolo VS02 Stencil is a durable metal tool designed for precise solder paste application and BGA reballing. Ideal for PCB and IC repairs, it ensures accurate solder placement, long-lasting performance, and ease of use, making it a must-have for mobile phone motherboard repair and electronic soldering tasks.

Supported Model:

BGA153

BGA162

BGA169

BGA196

BGA221

BGA254

Key Features:
🔹 Easy to Use – Smooth design for efficient solder paste application.
🔹 High-Quality Material – Made from durable metal alloy for repeated use.
🔹 Precision Apertures – Accurate alignment for solder deposition on PCB pads.
🔹 Reballing Support – Perfect for BGA chip rework and component replacement.
🔹 Versatile – Suitable for various mobile PCB, IC, and CPU repairs.

Specifications:
Model: Welsolo VS02
Material: Metal Alloy (Heat Resistant & Durable)
Application: PCB Repair, BGA Reballing, IC/CPU Chip Soldering
Design: Precision aperture layout for controlled solder paste deposition

Packing Details:
1 × Welsolo VS02 Stencil