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YCS Magnetic Pad Tin Planting Arc Motherboard CPU & NAND IC Repair Pad

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₹285.00

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Detail Description

The YCS Magnetic Repair Pad is specially designed for CPU, NAND, and IC tin planting & motherboard repair. Its arc design with memory foam layer ensures better alignment, stability, and precision during soldering and chip reballing. Perfect for technicians working on high-end mobile motherboard and IC repairs.

Key Features

  • Magnetic pad for stable IC & CPU positioning
  • Arc-shaped design for accurate tin planting
  • Integrated memory foam for cushioning & safety
  • Ideal for CPU, NAND, IC repair & reballing work
  • Heat-resistant and durable for long-term use

Specifications

  • Model: YCS Magnetic Arc Repair Pad
  • Material: High-quality Magnetic Base + Memory Foam
  • Application: CPU, NAND, IC Reballing & Motherboard Repair
  • Type: Magnetic Positioning Repair Pad

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