The YCS 138°C Low Temperature Solder Paste is
specially designed for BGA IC, CPU, PCB, and SMD repair. With its low
melting point of 138°C, it is ideal for delicate motherboard reballing,
chip bonding, and SMD soldering work where overheating may cause damage.
Ensures strong bonding, reliable conductivity, and professional repair
results for mobile, laptop, and computer motherboards.
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