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YCS Solder Paste 150°C for BGA IC CPU PCB SMD Repair & Motherboard Reballing

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₹269.00

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The YCS 150°C Solder Paste is designed for BGA IC, CPU, PCB, and SMD repair applications, offering a low–medium temperature solution ideal for motherboard reballing and chip bonding work. With its 150°C melting point, it ensures precise soldering, reliable conductivity, and efficient heat performance without damaging sensitive components. Perfect choice for professional technicians handling mobile and computer motherboard repair.

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