The YCS 150°C Solder Paste is designed for BGA IC,
CPU, PCB, and SMD repair applications, offering a low–medium temperature
solution ideal for motherboard reballing and chip bonding work. With
its 150°C melting point, it ensures precise soldering, reliable
conductivity, and efficient heat performance without damaging sensitive
components. Perfect choice for professional technicians handling mobile and
computer motherboard repair.
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