The YCS 183°C BGA Repair Syringe Flux is a medium-temperature
solder paste specially designed for IC, CPU, GPU, and BGA reballing work.
With its syringe-style dispenser, it ensures accurate application,
reducing wastage and improving soldering efficiency. Ideal for mobile phone,
laptop, and motherboard repair, this paste provides strong bonding,
smooth soldering, and reliable conductivity.
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