The YCS 199°C Solder Paste is specially formulated
for BGA IC, CPU, PCB, SMD repair, and motherboard reballing. With its high
melting point (199°C), it ensures strong bonding, stable performance,
and long-lasting durability. Designed for professional mobile and computer
motherboard repairs, this paste provides smooth soldering, reliable
conductivity, and precise rework results. Perfect for chip-level repair
engineers.
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