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YCS Solder Paste 199°C for BGA IC CPU PCB SMD Repair & Motherboard Reballing

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₹289.00

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Detail Description

The YCS 199°C Solder Paste is specially formulated for BGA IC, CPU, PCB, SMD repair, and motherboard reballing. With its high melting point (199°C), it ensures strong bonding, stable performance, and long-lasting durability. Designed for professional mobile and computer motherboard repairs, this paste provides smooth soldering, reliable conductivity, and precise rework results. Perfect for chip-level repair engineers.

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