The 2UUL BG01 ABCD Reballing Stencil Set (4 Pcs/Pack) is a professional-grade precision micro-soldering stencil kit engineered specifically for Apple iPhone motherboard repair, chip-level BGA reballing, and logic board rework. Managing individual, mismatched stencils across different iPhone generations often leads to aperture misalignments, solder bridging, and wasted workbench time. The BG01 set simplifies chip servicing by categorizing the entire component matrix of iPhone models from iPhone 8 up to iPhone 16 Pro Max into four dedicated high-precision stencils (Sheets A, B, C, and D), accompanied by four precision scraping blades.

Manufactured from select Japanese flexible alloy stainless steel, the BG01 features an advanced rounded-corner square hole aperture design. This geometry prevents molten solder balls from sticking inside the mesh during hot-air reflow, ensuring uniformly rounded, full solder balls that release effortlessly without tearing off motherboard pads. The ultra-fine 0.1mm thickness profile offers exceptional thermal conductivity and anti-warping resistance under direct hot-air desoldering. Whether reballing Apple A11 through A18 Pro application processors, NVMe NAND flash chips, baseband modems, Wi-Fi modules, or micro-sensor ICs, the 2UUL BG01 ABCD set is an indispensable workshop standard for professional mobile repair shops, board-level diagnostic centers, and micro-soldering technicians.

Key Features

1. Comprehensive iPhone 8 to 16 Pro Max Coverage: Four dedicated stencil plates cover all major surface-mount BGA semiconductors across nine generations of iPhones.
2. Categorized 4-Sheet Architecture:
3. Sheet A: Application Processors (A11 to A18 Pro CPUs) & High-Capacity NAND Flash Memory.
4. Sheet B: Cellular Baseband Processors & Wi-Fi / Bluetooth IC Modules.
5. Sheet C: Radio Frequency (RF) Transceivers, Power Amplifiers (PA), and Small Logic ICs.
6. Sheet D: Display Driver ICs, Face ID / Dot Projector Modules, Charging Dock Circuits, Infrared & True Tone Sensors.
7. Rounded-Corner Square Apertures: Precision laser-cut profile ensures solder balls form fully and round without catching or jamming inside the stencil holes.
8. Superior Thermal Bulge Resistance: High-grade alloy steel withstands direct hot-air rework temperatures without warping, buckling, or lifting away from chip surfaces.
9. Includes 4 Precision Scraping Blades: Comes with four dedicated steel scraper blades to apply smooth, uniform solder paste across micro-apertures.
10. Magnetic Fixture Ready: Fully compatible with magnetic reballing bases (such as the 2UUL BH11 and BH15) for rock-solid bench stabilization.
11. Accurate Alignment & High Yield: Precision-milled alignment markings ensure rapid positioning over BGA pads, significantly reducing soldering rework rates.

Specifications

1. Brand: 2UUL
2. Model: BG01
3. Product Name: BG01 ABCD Reballing Stencil Set
4. Product Type: BGA Tin Planting Steel Mesh Set
5. Quantity: 4 Pieces per Pack (Sheets A, B, C, D) + 4 Steel Scraping Blades
6. Stencil Thickness: 0.1 mm Ultra-Fine Precision Profile
7. Material: High-Elasticity, Heat-Resistant Japanese Alloy Stainless Steel
8. Aperture Geometry: Laser-Cut Square Holes with Rounded Corners
9. Product Dimensions: 100 mm × 85 mm × 0.1 mm (Per Stencil)
10. Net Weight: Approx. 28 g
11. Gross Weight: Approx. 35.4 g
12. Packaging Dimensions: 105 mm × 90 mm × 1.2 mm
13. Device Compatibility: Apple iPhone 8 / 8 Plus / X / XR / XS / XS Max / 11 / 11 Pro / 11 Pro Max / 12 / 12 mini / 12 Pro / 12 Pro Max / 13 / 13 mini / 13 Pro / 13 Pro Max / 14 / 14 Plus / 14 Pro / 14 Pro Max / 15 / 15 Plus / 15 Pro / 15 Pro Max / 16 / 16 Plus / 16 Pro / 16 Pro Max
14. Chip Compatibility: A11, A12, A13, A14, A15, A16, A17 Pro, A18 Pro CPUs, NAND Flash, Baseband, Wi-Fi/BT, Power Management ICs (PMIC), Audio Codecs, Face ID, Display ICs
15. Application Range: Motherboard BGA Chip Reballing, Solder Paste Application, Chip Tin Planting, Motherboard Sandwich Board Rework

Package Includes

1. 1 × 2UUL BG01 Sheet A (CPU & NAND Flash)
2. 1 × 2UUL BG01 Sheet B (Baseband & Wi-Fi IC)
3. 1 × 2UUL BG01 Sheet C (RF & Power Amplifier IC)
4. 1 × 2UUL BG01 Sheet D (Display, Face ID & Sensor ICs)
5. 4 × Precision Steel Solder Paste Scraping Blades

Important Notice & Terms

Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.