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2UUL BG03 0.12mm Reballing Stencil for iPhone 17 Series Laser-Cut High-Elasticity BGA Tin Planting Steel Mesh for A19 Pro CPU, NAND Flash & Logic Board IC Repair

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₹383.90 ₹345.51

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Detail Description

The 2UUL BG03 0.12mm Reballing Stencil for iPhone 17 Series is a dedicated next-generation micro-soldering tin planting template engineered specifically for Apple iPhone 17, iPhone 17 Air, iPhone 17 Pro, and iPhone 17 Pro Max logic board repair and BGA semiconductor rework. As mobile hardware advances to tighter silicon lithography nodes, ball pitch spacing between adjacent pins on core processors and memory chips shrinks dramatically. Using older or generic stencils leads to severe aperture mismatch, molten solder bridging, and incomplete ball formation. The BG03 solves this by providing a laser-cut high-precision aperture layout engineered precisely for the iPhone 17 series component footprint, including the A19 / A19 Pro application processor, high-density NVMe NAND flash, baseband modem, and power management ICs (PMIC).

Constructed from premium high-elasticity Japanese alloy stainless steel, the BG03 features an optimal 0.12mm thickness profile combined with chemically micro-etched, rounded-corner square apertures. These tapered aperture sidewalls allow solder paste to release effortlessly during hot-air reflow, ensuring uniform, spherical solder balls that seat firmly on microscopic solder pads without sticking inside the mesh. The high-temperature alloy construction delivers exceptional thermal stability, resisting buckling, bulging, or thermal warping under direct hot-air desoldering nozzles. Backed by universal pitch grids and bundled with a precision scraping blade, the 2UUL BG03 is an indispensable benchtop asset for mobile repair workshops, motherboard diagnostic centers, and chip-level micro-soldering technicians.

Key Features

  1. Tailored for iPhone 17 Series Architecture: Precision pinout alignment for iPhone 17, iPhone 17 Air, iPhone 17 Pro, and iPhone 17 Pro Max motherboards.
  2. Dedicated Next-Gen Chipset Support: Engineered for A19 and A19 Pro CPUs, high-speed NAND flash storage, Wi-Fi 7 modules, RF transceivers, and primary PMICs.
  3. Calibrated 0.12mm Stencil Thickness: Delivers the ideal solder ball volume and height required for ultra-fine-pitch next-generation BGA arrays.
  4. Rounded-Corner Square Apertures: Laser-milled square holes with rounded corners prevent solder paste adhesion and eliminate solder bridging between tightly spaced pads.
  5. Superior Thermal Warping Resistance: High-flexibility alloy steel dissipates heat evenly across the plate, preventing stencil lifting or bulging during direct hot-air heating.
  6. Includes Precision Scraping Blade: Comes with a dedicated steel scraper blade for smooth, bubble-free solder paste spreading across micro-apertures.
  7. Magnetic Fixture Compatible: Works seamlessly with magnetic reballing bases (such as the 2UUL BH11 and BH15) for stable, drift-free workbench operation.

Specifications

  1. Brand: 2UUL
  2. Model: BG03
  3. Product Name: BG03 Reballing Stencil for iPhone 17 Series
  4. Product Type: High-Precision BGA Reballing Stencil
  5. Thickness Profile: 0.12 mm Precision Thickness
  6. Material: High-Elasticity, Heat-Resistant Japanese Alloy Stainless Steel
  7. Aperture Technology: Chemical Laser-Cut Square Holes with Rounded Corners
  8. Product Dimensions: 100 mm × 85 mm × 0.12 mm
  9. Net Weight: Approx. 14 g
  10. Gross Weight: Approx. 22 g
  11. Packaging Dimensions: 105 mm × 90 mm × 1.2 mm
  12. Device Compatibility: Apple iPhone 17, iPhone 17 Air, iPhone 17 Pro, iPhone 17 Pro Max
  13. Chip Compatibility: Apple A19 / A19 Pro CPU, NVMe NAND Flash, Wi-Fi 7 ICs, Baseband Modems, Display Power ICs, Audio Codecs, and Small Peripheral SMDs
  14. Application Range: BGA Chip Reballing, Solder Paste Tin Planting, Pad Reconditioning, Double-Layer Board Chip Level Servicing

Package Includes

  1. 1 × 2UUL BG03 0.12mm Reballing Stencil for iPhone 17 Series
  2. 1 × Precision Solder Paste Scraping Blade

Important Notice & Terms

Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.

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383.9