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The 2UUL BH08 The One Jig (Black Edition) is a heavy-duty, heat-insulated universal motherboard and IC maintenance fixture engineered specifically for smartphone logic board repair, double-layer PCB servicing, and BGA chip glue removal. Built with a high-density, heat-resistant matte black synthetic stone/alloy chassis and a solid weighted foundation, it delivers superior thermal insulation, preventing board warping, blistering, or heat absorption during hot air desoldering operations.
Featuring an ultra-smooth, non-rebound rotary screw clamping mechanism, the BH08 securely locks irregular smartphone motherboards, CPUs, NAND flash chips, and PMICs into place without mechanical spring-back or slippage. Its specialized stepped clamping jaws are engineered to support delicate IC beams during underfill black glue scraping, preventing fragile silicon dies from cracking. Complete with multi-level distance positioning, bottom-mounted heat sink ventilation channels, and non-slip silicone feet, the BH08 provides a stable, vibration-free platform for high-precision micro-soldering under the microscope.
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Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.
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