The 2UUL BH30 The Smile JIG Mini is a compact, high-precision motherboard and IC maintenance fixture engineered specifically for smartphone logic board repair, micro-soldering, BGA reballing, and component desoldering. Designed with an ultra-compact, space-saving footprint, it delivers maximum workstation flexibility without crowding your bench under high-magnification trinocular microscopes.

Featuring a specialized curved "Smile" precision clamping jaw and a smooth screw-driven sliding track, the BH30 locks various smartphone motherboards, sub-boards, CPUs, NAND flash memory, and PMIC chips securely with zero rebound or slippage. Built from high-temperature resistant synthetic materials and high-strength metal components, it withstands direct hot air rework while insulating delicate PCB layers from thermal stress. Its anti-skid base provides rock-solid stability, preventing accidental movement during delicate wire jumping, pad repair, and glue scraping.

Key Features

1. Ultra-Compact Mini Form Factor: Slim, portable design frees up valuable workbench area and fits cleanly beneath all repair microscope lenses.
2. Curved "Smile" Contour Clamping: Provides multi-point mechanical grip to hold irregular motherboard edges, small sub-boards, and micro ICs firmly in place.
3. Non-Rebound Screw-Driven Lock: Precision threaded mechanism ensures zero-play clamping that will not loosen or slip under tool pressure.
4. Heat-Resistant Thermal Insulation: Built to endure high-temperature hot air rework without deforming, protecting multilayer logic boards from heat shock.
5. Anti-Break IC Support Design: Specially contoured clamp steps support delicate silicon dies during BGA black glue and underfill scraping.
6. Anti-Slip Stable Base: Features integrated silicone feet that grip silicone repair mats firmly to eliminate sliding during fine microscope work.
7. Wide Maintenance Versatility: Perfect for CPU/NAND reballing, logic board trace repairs, FPC connector soldering, and small component replacement.

Specifications

1. Brand: 2UUL
2. Series: The Smile JIG Series
3. Model: BH30
4. Product Type: Mini Universal Mobile Phone Motherboard & IC Chip Repair Fixture
5. Material: High-Temperature Resistant Synthetic Composite & CNC Metal Alloy
6. Clamping Mechanism: Precision Screw-Slide "Smile" Stepped Jaws
7. Heat Resistance: High Temperature Safe (Hot Air Gun & Soldering Iron Proof)
8. Compatibility: Universal Smartphone Motherboards (iPhone & Android), Sub-Boards, CPU, NAND Flash, Wi-Fi IC, Baseband & Small SMD ICs
9. Application: Mobile Logic Board Repair, BGA IC Reballing, Micro-Soldering, Underfill Glue Removal, Component Desoldering

Package Includes

1. 1 × 2UUL BH30 The Smile JIG Mini Motherboard & IC Repair Fixture

Important Notice & Terms

Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.