The 2UUL BH31 "The Smile JIG" is a high-precision, heavy-duty universal motherboard and IC maintenance fixture engineered specifically for smartphone logic board rework, micro-soldering, and BGA chip repair. Constructed from high-density, heat-resistant synthetic alloy capable of withstanding extreme soldering temperatures up to 500°C, it delivers outstanding thermal isolation, preventing heat absorption from desoldering guns and protecting fragile multi-layer circuit boards from warping or bubbling.

Designed with an innovative curved "Smile" V-shaped precision clamping jaw and a non-slip weighted base, the BH31 locks irregular phone motherboards, CPUs, NAND flash chips, and Wi-Fi ICs firmly into place with zero slippage or board rebound. The fine-machined stepped clamping edge ensures accurate component alignment while preventing edge crushing during tough underfill black glue removal and reballing. Its easy-to-clean, chemical-resistant surface makes it an indispensable bench tool for mobile repair technicians and service workshops.

Key Features

1. 500°C High-Temperature Resistance: Heavy-duty alloy and insulated composite withstand direct hot air rework without deforming or transferring excess heat.
2. Curved "Smile" V-Shaped Clamp: Engineered clamp contour provides multi-point contact, gripping irregular motherboards, small sub-boards, and micro ICs securely.
3. Zero-Rebound Precision Locking: Smooth rotary screw mechanism locks circuit boards and chips firmly without spring-back or shifting under microscope inspection.
4. Prevents Chip & Pad Damage: Specialized clamping steps support delicate silicon dies during BGA underfill and black glue scraping.
5. Heavy Anti-Skid Foundation: Weighted base with high-grip silicone pads ensures vibration-free stability across workbench repair mats.
6. Wide Repair Versatility: Ideal for CPU/NAND reballing, logic board trace jumping, FPC connector replacement, and component desoldering.
7. Chemical & Flux Resistant: Smooth surface cleans off effortlessly with isopropyl alcohol (IPA) and standard PCB cleaning solvents.

Specifications

1. Brand: 2UUL
2. Series: The Smile JIG Series
3. Model: BH31
4. Product Type: Universal Mobile Phone Motherboard & IC Chip Maintenance Fixture
5. Temperature Resistance: Up to 500°C (Hot Air Gun & Soldering Iron Safe)
6. Material: High-Density Heat-Resistant Synthetic Stone / Alloy Body
7. Clamping Mechanism: Precision Screw-Driven V-Shaped / Stepped Jaw
8. Compatibility: Universal Smartphone Motherboards (iPhone & Android), Sub-Boards, CPU, NAND Flash, Wi-Fi IC, Baseband Chips
9. Application: Micro-Soldering, BGA IC Reballing, Glue Scraping, Motherboard Diagnostics, FPC Connector Soldering

Package Includes

1. 1 × 2UUL BH31 The Smile JIG Motherboard & IC Repair Fixture

Important Notice & Terms

Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.