The 2UUL DW11 SolderAway Desoldering Wick 2015 (10 Rolls/Box) is a high-grade solder removal consumable engineered specifically for smartphone motherboard rework, BGA pad leveling, and precision micro-soldering. When desoldering IC chips or cleaning old lead-free alloy residues from mobile logic boards, inferior braids with poor thermal conduction or inadequate fluxing require prolonged iron dwell times. This excess heat frequently causes lifted PCB copper pads, scorched solder mask, and internal layer blistering. The DW11 solves this by combining a geometric precision weave of ultra-pure oxygen-free copper with an optimized low-residue, non-halogen flux core.

Engineered in a versatile 2.0mm width and 1.5m length (2015 specification), the flat braided copper structure maximizes surface contact area against dense BGA pin grids. Its rapid thermal conductivity draws heat instantaneously from soldering iron tips (such as C115-K, C210-K, or C245 knife tips), generating powerful capillary suction that vacuums up molten solder cleanly in a single, smooth pass. The non-corrosive, low-residue flux formulation prevents copper oxidation on the spool and leaves minimal, clear residue that cleans away effortlessly with Isopropyl Alcohol (IPA). Packaged in an economical 10-roll workshop cylinder, the 2UUL DW11 SolderAway is an indispensable daily benchtop consumable for mobile phone service centers, laptop repair engineers, and micro-soldering laboratories.

Key Features

1. High-Purity Oxygen-Free Copper: Dense, geometric wire braid provides immediate thermal transfer and powerful capillary suction for rapid solder absorption.
2. Low-Residue No-Clean Flux Formulation: Pre-fluxed with non-halogen, non-conductive rosin that leaves minimal transparent residue without corroding fine circuit traces.
3. Fast Single-Pass Pad Leveling: Cleans BGA pads flat in a single drag, drastically cutting iron contact time and protecting fragile copper traces from lifting.
4. Optimized 2015 Size Profile: 2.0mm width and 1.5m length per spool offer the ideal balance for iPhone and Android motherboard IC pad arrays, charging ports, and FPC pins.
5. Anti-Oxidation Spool Protection: High-tensile copper strands resist atmospheric oxidation, ensuring long shelf life and consistent wetting performance down to the end of the roll.
6. Protects Surrounding SMDs: Fast absorption reduces radiant heat spread across the PCB, safeguarding adjacent glued chips, underfill, and microscopic passives.
7. Workshop-Grade 10-Roll Pack: Sealed in a protective storage tube containing 10 individual dispensers, providing high-volume supply for busy repair benches.

Specifications

1. Brand: 2UUL
2. Series: SolderAway Series
3. Model: DW11
4. Product Name: DW11 SolderAway Desoldering Wick 2015
5. Product Type: Precision Braided Copper Desoldering Braid / Solder Removal Wick
6. Quantity: 10 Rolls per Cylinder Box
7. Braid Width: 2.0 mm
8. Roll Length: 1.5 m (Per Spool)
9. Size Classification: 2015 Spec (2.0mm × 1.5m)
10. Material: Ultra-Pure Oxygen-Free Braided Copper (OFC)
11. Flux Treatment: Integrated Mild No-Clean / Low-Residue Anti-Oxidation Flux
12. Compatibility: C115 / C210 / C245 / 936 Soldering Stations, Knife Tips, Chisel Tips
13. Application Range: BGA Solder Pad Cleaning & Leveling, CPU / NAND Desoldering Cleanup, Charging Port Extraction, SMD Solder Bridge Clearing, Motherboard Rework

Package Includes

1. 1 × 2UUL DW11 SolderAway Desoldering Wick Set (10 Rolls in Protective Cylinder)

Important Notice & Terms

Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.