The 2UUL FD40 Find 210 Chip Heating Glue Removal Station is a specialized precision heating attachment engineered specifically for smartphone motherboard micro-soldering, CPU/NAND degumming, and chip-level BGA rework. When removing hardened black underfill epoxy or resin glue from logic board semiconductors, relying solely on hot-air rework guns introduces severe risks: turbulent hot airflow can desolder neighboring microscopic SMD passives, warp thin multi-layer boards, or cause solder balls beneath adjacent chips to bridge and pop. The FD40 solves this by converting a standard C210 soldering iron handle into a direct-contact, localized mini heating station featuring a 16 × 17 mm precision thermal platen.

Operating within a calibrated working temperature range of 150°C to 200°C, the FD40 heats only the targeted integrated circuit. This targeted heat softens tough underfill glue and epoxy adhesives cleanly without reaching the full melting point of underlying solder balls prematurely or heating adjacent components. Weighing a mere 7 grams, the featherweight alloy unit mounts directly onto the C210 heating core using secure side-locking set screws, adding zero cumbersome weight to the handpiece and allowing steady, microscope-guided manipulation. Ideal for Apple A-series CPUs, Qualcomm Snapdragon chips, NVMe NAND memory, and baseband PMICs, the 2UUL FD40 is an indispensable workbench asset for mobile phone repair shops, motherboard diagnostic centers, and micro-soldering technicians.

Key Features

1. Direct-Contact Localized Heating: Targets thermal energy strictly to the IC package, eliminating heat spray and protecting surrounding sensitive components.
2. Calibrated 150°C–200°C Operating Window: Softens tough factory underfill and epoxy adhesives without overheating the PCB or melting internal solder joints.
3. 16 × 17 mm Universal IC Surface: Sized to cover standard smartphone application processors, NAND flash modules, baseband ICs, and primary PMICs.
4. Seamless C210 Handle Compatibility: Slides directly onto C210-series soldering iron handpieces, utilizing your station's PID temperature controller.
5. Ultra-Lightweight 7g Construction: Adds virtually no hand fatigue, providing micro-level agility and steady control under high-power stereomicroscopes.
6. Prevents Pad Tearing & Delamination: Pre-softens underfill to ensure scraper blades glide through glue cleanly without lifting fragile copper motherboard pads.
7. Durable High-Conductivity Alloy: Precision-machined thermal metallic alloy delivers fast heat conduction and long-term resistance to heat cycling.

Specifications

1. Brand: 2UUL
2. Series: Find 210 Series
3. Model: FD40
4. Product Name: FD40 Find 210 Chip Heating Glue Removal Station
5. Product Type: Mini IC Preheating & Underfill Degumming Attachment
6. Heating Surface Dimensions: 16 mm × 17 mm
7. Recommended Operating Temperature: 150°C – 200°C
8. Product Dimensions: 90 mm × 23 mm × 5 mm
9. Net Weight: Approx. 7 g
10. Gross Weight: Approx. 14.4 g
11. Handle Interface Compatibility: Standard C210-Type Precision Soldering Iron Handles
12. Clamping Mechanism: Precision Mechanical Clamping with Side-Locking Screws
13. Device Compatibility: Apple iPhone, iPad, Samsung Galaxy, Xiaomi, Vivo, Oppo, OnePlus, and Universal Logic Boards
14. Target Components: Application Processors (CPUs), NAND Flash Chips, Baseband ICs, Power Management ICs (PMICs), and Medium-to-Large BGA Semiconductors
15. Application Range: Underfill Softening & Degumming, Solder Pad Preheating, Epoxy Glue Scraping, BGA Reballing Prep

Package Includes

1. 1 × 2UUL FD40 Find 210 Chip Heating Glue Removal Station Platform
2. 1 × Set of Mounting Hardware & Side-Locking Screws

Important Notice & Terms

Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.