The 2UUL Micro Jig BH04 is a high-precision, heat-insulated mini motherboard and IC maintenance fixture engineered specifically for mobile phone logic board repair, CPU/NAND underfill black glue removal, and BGA chip rework. Built with premium tempered insulated synthetic stone/glass and a heavy-duty metallic base, it provides exceptional thermal insulation and structural stability, protecting delicate multi-layer circuit boards and double-decker motherboards from heat damage and warping during intense hot air operations.

Equipped with a non-rebound rotary screw locking mechanism, the BH04 firmly clamps mobile phone motherboards and individual IC chips without slipping or loosening under tool pressure. The specialized stepped clamp jaws are engineered to support the delicate underside and beam of ICs during glue scraping, preventing thin silicon dies and chips from snapping or breaking. With integrated multi-level gear adjustments, bottom-mounted heat sink dissipation channels, and anti-skid rubber feet, this mini jig delivers maximum precision and safety for microscopic soldering workflows.

Key Features

1. No-Rebound Rotary Locking: Precision threaded screw shaft locks motherboards and ICs firmly in place without spring-back or slippage.
2. Tempered Insulated Glass/Stone Build: High-temperature resistant insulated material prevents heat loss and shields delicate board layers from thermal stress.
3. Anti-Break IC Support Design: Engineered clamping jaws bear the mechanical force during underfill and black glue scraping, preventing delicate ICs and CPUs from cracking.
4. Multi-Level Distance Adjustment: Features high, medium, and low gear positioning to fit various smartphone motherboard sizes, odd-shaped PCBs, and standalone chips.
5. Efficient Bottom Heat Dissipation: Integrated heat sink structure at the base allows hot air to vent rapidly, avoiding PCB bubbling and pad delamination.
6. Heavy Anti-Skid Stable Base: Weighted foundation with silicone anti-slip feet prevents bench sliding and movement under high-magnification microscopes.

Specifications

1. Brand: 2UUL
2. Series: Micro Jig Series
3. Model: BH04
4. Product Type: Mini Universal IC & Motherboard Clamping Fixture
5. Material: Tempered Heat-Insulated Synthetic Glass / Stone & Precision Metal Alloy
6. Locking Mechanism: Non-Rebound Rotary Screw Shaft
7. Adjustment Levels: Multi-Gear Distance Positioning (High / Middle / Low)
8. Heat Resistance: High-Temperature Resistant (Hot Air Gun Safe)
9. Compatibility: Universal Mobile Motherboards (Single & Double-Layer PCBs), CPU, NAND Flash, Baseband, and PMIC Chips
10. Application: IC Glue Removal, BGA Reballing, Motherboard Soldering, Logic Board Component Repair

Package Includes

1. 1 × 2UUL Micro Jig BH04 Motherboard & IC Repair Fixture

Important Notice & Terms

Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.