The 2UUL SC88 IC Micro-Point Pry Needle Set is an ultra-fine, precision BGA chip disassembly tool engineered specifically for mobile phone motherboard repair, micro-soldering, and delicate IC lifting. Separating delicate baseband processors, audio ICs, power management ICs (PMICs), and NAND flash memory under heat often risks pulling logic board solder pads or chipping fragile silicon dies. The SC88 solves this with ultra-slim, high-elasticity micro-needle tips that slip effortlessly beneath melted BGA solder balls without gouging the board surface.

Paired with the 2UUL DA29 Ultralight Carbon Fiber Handle, the entire assembly weighs just 15 grams, delivering exceptional tactile sensitivity, thermal isolation, and zero hand fatigue during extended rework sessions under the microscope. Designed with precision point-control and including two interchangeable needle profiles, the 2UUL SC88 allows technicians to lift chips with minimal leverage force, protecting delicate copper bonding tracks and neighboring SMD passives on high-density smartphone logic boards.

Key Features

1. Ultra-Fine Point Penetration: High-elasticity micro-pointed needle tips easily slide beneath molten BGA IC solder arrays without tearing delicate PCB pads.
2. DA29 Ultralight Carbon Fiber Handle: High-strength, aerospace-grade carbon fiber body delivers natural thermal insulation and a featherweight tactile feel.
3. Featherlight 15g Net Weight: Ultra-low weight eliminates wrist strain and hand tremor, giving technicians millimeter-precise control under high-magnification microscopes.
4. Interchangeable Dual Pry Tips: Comes with 2 specialized micro-point needle geometries to accommodate varying chip edge clearances and underfill densities.
5. Protects Solder Pads & Traces: Smoothly lifts chips upward rather than scraping sideways, preventing pad delamination, copper track bridging, and chip corner fractures.
6. Heat-Resistant & Non-Deforming: Withstands high temperatures from hot air rework stations without losing tip stiffness or elasticity.

Specifications

1. Brand: 2UUL
2. Model: SC88
3. Handle Series: 2UUL DA29 Vajra Carbon Handle
4. Product Type: BGA IC Micro-Point Pry Needle & Chip Lifting Tool
5. Handle Material: High-Strength Ultralight Carbon Fiber
6. Needle Tip Material: High-Elasticity Hardened Alloy Steel
7. Net Weight: Approx. 15 g (Gross Weight: 22 g)
8. Package Dimensions: 144 × 51 × 11 mm
9. Compatibility: Universal Smartphone Motherboards (iPhone & Android Logic Boards), Tablets, Micro-Electronics
10. Application: BGA IC Chip Removal, CPU/NAND/PMIC Desoldering, Micro-Soldering Glue Cleaning, Pad Protection

Package Includes

1. 1 × 2UUL DA29 Ultralight Carbon Fiber Handle
2. 2 × 2UUL SC88 Precision IC Micro-Point Pry Needles

Important Notice & Terms

Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.