The 2UUL WAHE G101 UV Adhesive Series 25g Transparent is an advanced ultraviolet-activated photopolymer compound formulated specifically for mobile phone motherboard micro-soldering, BGA chip stabilization, display glass bonding, and delicate camera module alignment. Standard liquid adhesives begin curing immediately upon air contact, rushing technicians during intricate alignments and risking crooked components or adhesive skinning. The G101 solves this by remaining indefinitely workable under ambient conditions until activated by a high-intensity UV curing lamp, granting technicians unlimited working time to position microscopic SMDs, align optical lens frames, or bridge jumper wires under a microscope.

Upon exposure to 365nm–395nm UV light, the G101 completes its photo-initiated cross-linking within 3 to 5 seconds, solidifying into an optically clear, high-elasticity structural matrix. The cured adhesive resists mechanical vibration, thermal cycling, and micro-cracking while remaining removable via controlled bench heating (70°C–80°C) without tearing off motherboard solder pads or stripping sensitive flex cable traces. Dispensed through a precision-tapered micro-needle tip, the 2UUL WAHE G101 is an essential daily chemical consumable for professional mobile phone repair workshops, micro-soldering laboratories, and cleanroom refurbishing centers.

Key Features

1. On-Demand UV Curing: Remains fully workable until activated under a UV lamp, providing unlimited adjustment time for delicate alignment tasks.
2. Ultra-Fast 3–5 Second Curing: Rapidly hardens under 365nm–395nm ultraviolet light, eliminating clamping delays and accelerating bench throughput.
3. Optically Clear Transparent Finish: Cures crystal-clear with zero yellowing, haze, or residue, making it ideal for optical sensor brackets and narrow bezels.
4. Crack-Resistant Resilient Bond: Flexible cured polymer cushions against physical drops, chassis flexing, and thermal shocks without embrittlement.
5. Heat-Assisted Safe Disassembly: Softens under moderate bench heat (70°C–80°C) during future rework, preventing lifted BGA pads or ripped circuit traces.
6. Insulating PCB Protection: High dielectric strength seals exposed copper traces, anchors flying jumper wires, and protects delicate SMDs from moisture and oxidation.
7. Precision Micro-Dispensing: Fine nozzle tip enables accurate micro-droplet application directly to dense motherboard layouts without overflowing.

Specifications

1. Brand: 2UUL
2. Series: WAHE Series
3. Model: G101
4. Product Name: WAHE G101 UV Adhesive Series 25g Transparent
5. Product Type: Ultraviolet-Curable Liquid Adhesive / Optical Solder Mask
6. Net Weight / Capacity: 25 g
7. Color / Clarity: Crystal-Clear Transparent
8. Curing Wavelength: 365 nm – 395 nm Ultraviolet Light
9. Curing Speed: 3–5 Seconds Initial Tack; Complete Structural Cure in 10–15 Seconds
10. Post-Cure Flexibility: High-Tensile Elastic, Crack-Resistant
11. Rework / Removal: Low-Heat Softening (Approx. 70°C–80°C via Hot Air or Heating Plate)
12. Dielectric Properties: Fully Insulating, High Electrical Resistance
13. Compatibility: Apple iPhone, iPad, Samsung Galaxy, Xiaomi, Vivo, Oppo, OnePlus, Smartwatches, and Laptop Motherboards
14. Application Range: Jumper Wire Anchoring, BGA CPU/IC Temporary Fixing, Screen Glass Lamination, Camera Module Positioning, Flex Cable Reinforcement, Solder Pad Insulation

Package Includes

1. 1 × 2UUL WAHE G101 Transparent UV Adhesive (25g Tube with Precision Tip)

Important Notice & Terms

Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.